Heatsink assembly

ABSTRACT

This present invention related to a heatsink structure, used to dissipate heat from heat source component, comprises a heat conduction member, a heat transfer member and heatsink fins. Wherein the heat conduction member comprises a thermal pad and a clip; and the thermal pad, one of the sides connected with the heat source component, having at least one buckle pillar and one screw pillar. The heat transfer member, one side connected with the thermal pad in heat conductive manner. The heatsink fins connected with the other side of heat transfer member. The present invention uses the buckle pillar and screw pillar of the thermal pad to support the clip. The clip, connected with the buckle pillar and the screw pillar, can fix the heat source component and enable the surface heat generated from the heat source component connected with a thermal pad in heat conductive manner.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a heatsink assembly of electronicdevices, applied to heat-dissipating which heat generated by chipset,particularly used in a computer.

2. Description of the Related Art

Accompany with the continuous upgrade in operation ability and speed ofthe Central Processing Unit (CPU) or video chipset of computer, thelarge quantity of those electronic component's operation results in ahigh temperature occurred. However, there is a temperature limit foreach electronic component; the high temperature not only will reduce theworking efficiency of the electronic component, but also may damage oreven burnout the electronic component. Therefore, the heat-dissipatingissue becomes one of important step in the product design of a computer.In order that the computer may work at a normal temperature, a heatsinkassembly has been a necessary component in a notebook computer.

Referring to FIG. 1 shows a perspective view of a conventional heatsinkdevice, composed of a heat conduction module and a fan module. The heatconduction module comprises a thermal pad 211, a heat transfer member 23and heatsink fins 24. The fan module 30 composed of a fan and a casing.

The heat conduction module thermally conducts heat from aheat-generating component such as CPU or video chipset, etc., via thethermal plate.

The heat generated from the heat conduction module thermally conductsthe heat through the heat transfer member (heat pip), to the heatsinkfins; wherein the heatsink fins are constructed with a plurality ofparallel fins, and the radiate area can be increased. The exchange ofheat occurs between the heatsink fins and cooling wind generated bymeans of the fan module. The heat is expelled from the computer in orderto achieve cooling objectives.

Usually, the heatsink device is positioned on CPU or on video chipset ofmother board, via thermal pad of heatsink device closely attached to thesurface of the CPU or video chipset in order to perform thethermally-conducting and heat-dissipating function; however, due to highrequest to the display function of interface card in portable notebookcomputer, interface cards is tending to upgrade to insert card as deskcomputer, resulted the conventional heatsink device is not suitableanymore.

SUMMARY OF THE INVENTION

It is an object to provide a heatsink assembly, used in a thermal modulefor an interface card. By this invention practices, the heatsinkassembly not only can fix the interface card to avoid damage occurredduring carry or movement the portable notebook computer, but also candissipate the heat generated by a video chip or a graphic chip in ainterface card when it is operating.

To reach above, the present invention provides a heatsink assemblycomprising a heat conduction member, a heat transfer member and heatsinkfins, the heat conduction member comprising a thermal pad and a clip.The thermal pad is a well thermal conductive metal plate, connected withheat source component of electric device. The side engaged with heatsource component having at least one buckle pillar and a screw pillar.The clip of heat conduction member is constructed of a pair of springplate and a pair of beam. The spring plate corresponds to each of bucklepillar having a buckle and corresponds to each of screw pillar having ascrewed hole. The heat transfer member, one side engaged with thermalpad, the other side engaged with heatsink fins, is used to transfer theheat generated from thermal pad to the heatsink fins. The heatsink finsexpel the heat from heat transfer member by the cooling wind from fanmodule. The thermal pad supports clip by at least one of the bucklepillar and one of the screw pillar; the clip connected with the bucklepillar and the screw pillar, fixed the heat source component, to let theheat generated surface of the heat source component, connect with thethermal pad in heat conductive manner.

Thus, the implementation of the present invention brings forth at leastthe following desirable results:

-   1. The heat from interface card can be dissipated efficiently when    it is operating.-   2. The heatsink assembly can stable combine together with interface    card.-   3. The assembly process will be more simple and efficiency when the    heatsink assembly connects with interface card.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will become more fully understood from the detaileddescription given below for illustration only, and thus are notlimitative of the present invention, and wherein:

FIG. 1 shows an exploded perspective view of one embodiment ofconventional heatsink device;

FIG. 2 shows a perspective view of one embodiment of the presentinvention of the heatsink assembly;

FIG. 3 shows a perspective view of one embodiment of the fan module anda heatsink supporter;

FIG. 4 shows a perspective view of one embodiment of the presentinvention of heatsink assembly connected with a fan module and aheatsink supporter;

FIG. 5 shows an exploded perspective view of one embodiment of presentinvention of a heatsink assembly and an interface card;

FIG. 6 shows a perspective view of a present invention of heatsinkassembly connected with a interface card; and

FIG. 7 shows a sectional view A-A of one embodiment of the presentinvention of heatsink assembly connected with display card.

DETAILED DESCRIPTION OF THE INVENTION

Referring to FIG. 2, shows a perspective view of one embodiment of thepresent invention of the heatsink assembly, utilized in an electronicdevice to dissipate heat from heat source component (video chipset orgraphic chipset), comprised: a heat conduction member 21, a heattransfer member 23 and heatsink fins 24; further to a heat conductionmember 21 comprises a thermal pad 211 and a clip 216.

A thermal pad 211 of heat conduction member 21 is a well thermallyconductive plate, utilized to thermal conductive connection with asurface generated heat from heat source component 51 of electronicdevice, to dissipate heat during operation from heat source component 51wherein has a video chipset or graphic chipset. Enable to achieve theheat conductive well, the thermal pad 211, is usually made of a copperor an aluminum, to have better thermal conductive effect.

Enable to close connected with heat source component 51, one side of thethermal pad 211 connected with heat source component 51, has at leastone buckle pillar 212 and one crew pillar 214. To stable connect withthermal pad 211, those pillars are pressed on the thermal pad 211. Nearthe top of a buckle pillar 212 has a horizontal ring curve 213

And on the top of a screw pillar 214 will has a screw hole 215.

The clip 216, is constructed of a pair of spring plate 217 and a pair ofbeam 222; the beam 222 is applied to hold still the spring plate 217;the spring plate 217, a cure plate, having a buckle 219 to connect witheach buckle pillar 212. For each screw pillar 214, having a screwed hole218 therein; Enable to simple connect with clip 216 and buckle pillar212, the buckle 219 is designed to have a buckle portion 220 and aextend portion 221.

The heat transfer member 23, one side connected with thermal pad 211, isto transfer the heat generated heat from thermal pad 211 to heatsinkfins 24; one of the heat transfer member 23 is preferred to be a heatpipe.

The heatsink fins 24, connected with the other side of heat transfermember 23, is composed of a plurality of parallel fins where arevertical connected with heat transfer member 23. Each fin is a thinslice shape.

Referring to FIG. 3 shows a perspective view of a fan module and aheatsink support; referring to FIG. 4 shows a perspective view of oneembodiment of the present invention of heatsink assembly connect withfan module and heatsink support; from above illustrations, theembodiment of present invention of heatsink assembly 20, supported byheatsink support 40, can hold stable with thermal pad 211 and heatsource component 51; and via fan module 30 offered the cooling wind todissipate the heat gathered by heatsink fins 24, can be expelledefficiency.

Referring to FIG. 5 shows an exploded perspective view of one embodimentof the present invention of a heatsink assembly and an interface card;and referring to FIG. 6 shows a combined perspective view of embodimentof the present invention of heatsink assembly and an interface card;wherein the an interface card 50, is suchlike a display interface card(VGA) or a graphic interface card (MXM) etc; a display chipset orgraphic chipset of interface card 50 is down below interface card 50.The interface card 50 is via a slot 61 of mother board 60 to connectwith mother board 60. By use the hole 52 set on interface card 50, thebuckle pillar 212 and screw pillar 214 of thermal pad 211 can easy getthrough the hole 52; after that, buckle 219 of the clip 216 can connectwith ring curve 213 of buckle pillar 212; and screwed hole 218 of theclip 216, aim at the screw hole 215 of screw pillar 214, can screw onthe screw pillar 214 via the screw to tighten them.

As the clip 216 is connected with ring curve 213 of buckle pillar 212.The buckle 219 having a buckle potion 220 and a extend potion 221, viaextend potion 221 space, the buckle 219 can be more easy to aim atbuckle pillar 212. Plus spring plate 217 of clip 216 is a curve plate;when clip 216 one side is connected with the buckle pillar 212, theother side is screwed into the screw pillar 214, the tension will beoccurred when clip be pressured. Via wherein the tension, the interfacecard can be stably hold.

Referring to FIG. 7 shows a sectional combined perspective view in A-Aline of embodiment of the present invention of the heatsink assembly anda display interface card; via practicing the present invention ofheatsink assembly, the surface, heat generated from the heat sourcecomponent 51 of interface card 50, can closely attach to thermal pad211.

Those described above are only the preferred embodiments of the presentinvention, and it is no intended to limit the scope of the presentinvention. And equivalent variation and modification according to theappended claims of the present invention would not depart from thespirit of the present invention and is to be included within the scopeof the present invention.

1. A heatsink assembly, connected with a fan module, used to dissipatingthe heat produced by heat source component in an electronic device,comprising: a heat conduction member, said heat conduction memberfurther comprising: a thermal pad, one of the side connected with saidheat source component, having at least one buckle pillar and one screwpillar; a clip having a pair of spring plate and a pair of beam, whereinsaid spring plate corresponding to each of said buckle pillar having abuckle and corresponding to each of said screw pillar having a screwedhole; a heat transfer member, one side connects with said thermal pad;and heatsink fins, wherein said heatsink fins connect with the otherside of said heat transfer member, wherein said thermal pad supportedsaid clip by said buckle pillar and screw pillar, and said clip,connected with said buckle pillar and said screw pillar, fixed said heatsource component and enabled the surface, heat generated from said heatsource component, connected with said thermal pad in heat conductivemanner.
 2. The heatsink assembly as claimed in claim 1, wherein saidthermal pad is a plate.
 3. The heatsink assembly as claimed in claim 1,wherein said thermal pad is made of copper or aluminum.
 4. The heatsinkassembly as claimed in claim 1, wherein said buckle pillar and screwpillar are connected with thermal pad.
 5. The heatsink assembly asclaimed in claim 1, wherein said spring plate is a curve spring plate.6. The heatsink assembly as claimed in claim 1, wherein said heattransfer member is a heat pipe.
 7. The heatsink assembly as claimed inclaim 1, wherein said heatsink fins are constructed of a plurality ofparallel fins, vertical with said heat transfer member.
 8. The heatsinkassembly as claimed in claim 7, wherein said heatsink fin is a sheetshape.
 9. The heatsink assembly as claimed in claim 1, wherein saidbuckle includes a buckle potion and an extend potion: